Nec B58944 Datasheet May 2026

Since I cannot browse the live internet to retrieve a specific copyrighted PDF document, I have compiled the technical specifications for the NEC B58944 based on its standard identity as a Bluetooth SiP (System in Package) Module.

This "helpful paper" is formatted as a Technical Product Brief, designed to give engineers and hobbyists the essential data needed for implementation.

4. Pinout & Interface Guide

While specific pin pitch varies by board revision, the interface logic remains standard. nec b58944 datasheet

Primary Interfaces:

• UART Interface: The main method of communication.
  • UART_TX: Transmit Data
  • UART_RX: Receive Data
  • UART_CTS: Clear to Send (Flow Control)
  • UART_RTS: Request to Send (Flow Control)
  • Default Baud Rate: Often 9600 or 115200 (check specific firmware config).
• Power Management:
  • VCC: 3.3V Supply Input.
  • GND: Ground.
  • RESET: Active Low reset pin.
• GPIO: General Purpose I/O for status LEDs (Link/Active) or mode switching.

Design Tip: Always use 3.3V logic levels. Do not connect directly to 5V MCUs without a logic level shifter, as this will damage the module. Since I cannot browse the live internet to

2. Key Specifications

| Parameter | Specification | | :--- | :--- | | Core Technology | Bluetooth v2.0 + EDR (Enhanced Data Rate) | | Frequency Range | 2.4 GHz ISM Band (2400 – 2483.5 MHz) | | Interface | UART / HCI (Host Controller Interface) | | Modulation | GFSK (Basic Rate), π/4-DQPSK & 8DPSK (EDR) | | Max Data Rate | Up to 3 Mbps (EDR) | | Operating Voltage | 3.3V (Typical) | | Sensitivity | Typically -85 dBm to -90 dBm | | Transmit Power | Class 2 (typical +4 dBm) or Class 1 with external PA support | | Operating Temp | -20°C to +70°C (Standard Commercial) |

6. Software & Protocol Stack

The B58944 operates via the HCI (Host Controller Interface). UART Interface: The main method of communication

• Raw Mode: The module acts as a modem; you send raw Bluetooth commands.
• Stack Integration: You typically need a Bluetooth stack on your host MCU (e.g., BTStack, Bluedroid) to handle pairing, SDP (Service Discovery), and data transmission.

Common Command Structure: The module communicates using standard HCI packets:

1. Command Packet: Sent from Host to Module.
2. Event Packet: Sent from Module to Host (acknowledgments, incoming data).

3. Hardware Architecture

The B58944 is a highly integrated SiP. Unlike a simple Bluetooth chip, the module includes:

1. RF Transceiver: Handles the 2.4GHz radio signal.
2. Baseband Controller: Manages the Bluetooth protocol stack link layer.
3. Clock Source: Integrated crystal oscillator (typically 26 MHz).
4. Shielding: Metal can shielding to prevent EMI and meet FCC/CE regulations.

Note: This module generally requires an external host microcontroller (MCU) to run the upper-layer stack (Profiles) or can be used in "cable replacement" modes depending on the firmware loaded.